AMD just changed the game entirely. AMD made a stunning disclosure at Computex 2021 — the company has 3D-stacked chiplets based on the Zen 3 architecture that will go into production this year. These innovative new chiplets feature an additional 64MB of 7nm SRAM cache (called 3D V-Cache) stacked vertically atop the core complex die (CCD) to triple the amount of L3 cache for the CPU cores. That technique can yield up to an amazing 192MB of L3 cache per Ryzen chip — a massive improvement over the current limit of 64MB.
AMD CEO Lisa Su also showed a prototype Ryzen 9 5900X chip that the company already has up and running and provided a pretty impressive demo of accelerated gameplay due to the new architecture — the gains in 1080p gaming averaged in the 15% range. That's the type of gains that we typically associate with a new CPU microarchitecture and/or process node, but AMD accomplished this feat with the same 7nm node and Zen 3 architecture that already ships with its standard Ryzen 5000 models.
