- Aug 17, 2014
As chip makers look for ways to make their products more powerful, Intel says it has come up with a different way to hold transistors in substrate packages. Currently, the company uses organic material for substrates, but today, Intel says it is developing new glass materials for these products.
In a press release, Intel says it has been researching glass substrates for at least 10 years and now feels that it could replace organic materials by the end of this decade. Intel says: "Glass substrates possess superior mechanical, physical and optical properties that allow for more transistors to be connected in a package, providing better scaling and enabling assembly of larger chiplet complexes (called “system-in-package”) compared to organic substrates in use today. Chip architects will have the ability to pack more tiles – also called chiplets – in a smaller footprint on one package, while achieving performance and density gains with greater flexibility and lower overall cost and power usage."