Cooling manufacturer
Frore Systems has reportedly announced the world's first solid state cooling system, designed to cool CPUs, GPUs and SoCs operating inside devices such as laptops, handheld consoles tablets and more. The cooler design, called the AirJet, does not require any fans, instead using ultrasonic waves to push air through the cooling device. As a result, the device is incredible thin, and is capable of dissipating the same amount of heat as fan-based coolers, while maintaining very low power consumption and a silent footprint.
Frore Systems hasn't announced any actual computers featuring its Airjet solid state coolers. But the company is already in partnership with the likes of Intel and Qualcomm, so you can expect Intel and ARM based laptops to be arriving sometime in the future with this new cooler technology.
"The future of laptop performance and design depends on advances in thermal engineering," said Josh Newman, vice president and general manager of mobile innovation at Intel in a press release. "We collaborated deeply with Frore Systems to integrate AirJet into the Intel Evo platform. We are excited to introduce this cutting-edge technology to the open PC ecosystem."
The company has two models, the AirJet Mini and the AirJet Pro, both of which are just 2.8 mm thick. Both models intake air from four slits housed on the top of the cooling device, which then make their way to the interior of the cooling device where tiny membranes vibrate at ultrasonic frequencies to push that air out the sides of the cooling device.
The main difference between the Mini and the Pro is size and cooling capability. As the name implies, the Mini is the smaller of the two, aimed at cooling ultra-thin notebooks and tablets. The Mini features a total heat dissipation of 5.25W with a 85C die temperature on the processor, while consuming just 1W of power consumption at its max. The Mini generates 1,750 Pascals of back pressure and weights just 11 grams, measuring in at 27.5 mm wide by 41.5 mm long.
The Pro model is a slightly larger model that is designed to cool slightly larger (but still thin) mobile laptops and game consoles. The Pro features 10.5W of cooling power - at the same 85C die temperature, but consumes just 1.75W of power at its peak. The Pro features the same 1,750 Pascals of backpressure, but thanks to its larger 31.5mm x 71.5mm footprint, the Pro can cool substantially more power than the Mini. The only real downsides of the Pro is its slightly heavier weight at 22 grams, and slightly higher audio profile of 24dBA - vs 21dBA for the mini, but these numbers are still really good for any cooling solution.
www.tomshardware.com
