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<blockquote data-quote="Digerati" data-source="post: 700441" data-attributes="member: 59833"><p>Do note that Notebook Review links to just another poster expressing his opinion. Definitely not a professional review. </p><p></p><p>While different TIMs do offer different results, more important than "which" TIM you use is that you use TIM in the first place. And second, that you apply it properly. A proper application includes thorough cleaning of the mating surfaces first to ensure all traces of any previous application, dirt, skin oils and other contaminants are thoroughly removed. Then it is critical to apply a fresh new layer as thin as possible, yet still provide complete coverage. </p><p></p><p>To you, maybe, but not to others. </p><p></p><p>This really makes no sense. If the heatsink mounting mechanism is not damaged, there should be no problem. There is no such thing as a proper pressure other than to ensure the heatsink does not move once clamped in place. Too tight and you can crush the socket or damage the CPU. Too loose and the heatsink can move allowing insulating air to get in. This is a function of the heatsink mounting mechanism and again, unless damaged, no problem. </p><p></p><p>I have never seen a mounting mechanism apply too much pressure - when assembled properly. I've only seen too loose with PC motherboards that use back-plates that were secured improperly. </p><p></p><p>And there is no such thing as proper "distance". The most efficient transfer of heat occurs with <u>direct metal-to-metal contact</u>. TIM needs to only fill the microscopic pits and valleys in the metal mating surfaces that might trap insulating air. Any excess TIM is in the way! And any gap ("distance") between the mating surfaces would let insulating air in between - that would be bad. </p><p></p><p>Whoever told you some TIMs cause corrosion lied to you. If copper corrosion was a problem, the TIM packaging/instructions would clearly say, "Not for use on copper heatsinks" and I have never seen such a warning. The fact is, properly applied TIM keeps air (oxygen) out thus preventing corrosion/oxidation. If there really is corrosion, it is due to some other foreign contaminate that got in there - likely from poor cleaning. In other words, user error.</p><p></p><p>What may have been seen is dried, crusty TIM that was squished out to the edges of the bonded mating surfaces. But that is NOT corrosion, or a problem. TIM does not need to be replaced just because it dries. It is the solids in the TIM that perform the heat transfer function by filling the microscopic pits and valleys in the mating surfaces, thus keeping insulating air out. If the TIM dries, the solids are left behind and still doing their job. </p><p></p><p>As I noted way back in Post #7 on December 11th, <em>"The ONLY reason TIM is liquified in the first place is so you can squeeze it out of the tube and spread it out evenly.</em>"</p></blockquote><p></p>
[QUOTE="Digerati, post: 700441, member: 59833"] Do note that Notebook Review links to just another poster expressing his opinion. Definitely not a professional review. While different TIMs do offer different results, more important than "which" TIM you use is that you use TIM in the first place. And second, that you apply it properly. A proper application includes thorough cleaning of the mating surfaces first to ensure all traces of any previous application, dirt, skin oils and other contaminants are thoroughly removed. Then it is critical to apply a fresh new layer as thin as possible, yet still provide complete coverage. To you, maybe, but not to others. This really makes no sense. If the heatsink mounting mechanism is not damaged, there should be no problem. There is no such thing as a proper pressure other than to ensure the heatsink does not move once clamped in place. Too tight and you can crush the socket or damage the CPU. Too loose and the heatsink can move allowing insulating air to get in. This is a function of the heatsink mounting mechanism and again, unless damaged, no problem. I have never seen a mounting mechanism apply too much pressure - when assembled properly. I've only seen too loose with PC motherboards that use back-plates that were secured improperly. And there is no such thing as proper "distance". The most efficient transfer of heat occurs with [U]direct metal-to-metal contact[/U]. TIM needs to only fill the microscopic pits and valleys in the metal mating surfaces that might trap insulating air. Any excess TIM is in the way! And any gap ("distance") between the mating surfaces would let insulating air in between - that would be bad. Whoever told you some TIMs cause corrosion lied to you. If copper corrosion was a problem, the TIM packaging/instructions would clearly say, "Not for use on copper heatsinks" and I have never seen such a warning. The fact is, properly applied TIM keeps air (oxygen) out thus preventing corrosion/oxidation. If there really is corrosion, it is due to some other foreign contaminate that got in there - likely from poor cleaning. In other words, user error. What may have been seen is dried, crusty TIM that was squished out to the edges of the bonded mating surfaces. But that is NOT corrosion, or a problem. TIM does not need to be replaced just because it dries. It is the solids in the TIM that perform the heat transfer function by filling the microscopic pits and valleys in the mating surfaces, thus keeping insulating air out. If the TIM dries, the solids are left behind and still doing their job. As I noted way back in Post #7 on December 11th, [I]"The ONLY reason TIM is liquified in the first place is so you can squeeze it out of the tube and spread it out evenly.[/I]" [/QUOTE]
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