MediaTek and TSMC
announced their collaboration on the 3nm chip today. The chipmaker revealed that it has taped out its flagship Dimensity SoC using TSMC's 3nm process technology. This marks the first time MediaTek has developed a chip leveraging the 3nm process.
According to details shared in the announcement, the new 3nm chipset is expected to enter volume production sometime in 2024. This means it will not be commercially available this year, though it shows promise for future MediaTek's Dimensity powered devices.
In a statement, Senior Vice President of Europe and Asia Sales at TSMC, Cliff Hou, said: "This collaboration between MediaTek and TSMC on MediaTek's Dimensity SoC means the power of industry's most advanced semiconductor process technology can be as accessible as the smartphone in your pocket."
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