- Aug 17, 2014
- 11,111
Samsung Foundry this week outlined its longer-term roadmap covering its next-generation fabrication processes as well as expansion of its production capacities. The company has no plans of slowing down development and deploying new manufacturing technologies as well as expanding its manufacturing capacities to meet demand for advanced chips going forward.
Samsung Foundry intends to start making chips using its next-generation 2nm fabrication process by 2025 as well as its 1.4nm production node by 2027, according to a report by Nikkei. Earlier this year Samsung began to make semiconductors using its first-generation 3nm manufacturing technology (also known as 3GAE, or gate-all-around early). In 2024 the company will adopt its second-generation 3nm node (also known as 3GAP, or gate-all-around plus).
Samsung intends to triple its advanced chips production capacity by 2027, according to a Reuters report citing officials from the company. Samsung did not disclose exact targets and what it considered advanced production capacity, though it is certain that the company will continue to invest in new semiconductor capacities.
Samsung Plans to Adopt 1.4nm Process Tech by 2027
Samsung outlines plans for 2nm, 1.4nm production nodes.
www.tomshardware.com