In brief: Like other memory manufacturers, Samsung doesn't expect DDR5 to become mainstream before 2023. In the meantime, the South Korean company is building monster-sized DDR5-7200 modules for the data center, starting with a 512-gigabyte one that will enter mass production by the end of this year.
The
Hot Chips conference is still in flux, and Samsung is using the occasion to tease a special DDR5 memory module with a total capacity of over 512 gigabytes. This is a natural evolution from the current DDR4 modules that go up to 256 gigabytes in size, but it's also a story of numerous challenges that the company needed to overcome in order to get here.
The DDR5-7200 module was first
announced in March, and the memory chips are made using a High-K Metal Gate (HKMG) process that reduces leakage and pushes the limits of what DRAM can achieve in terms of performance. It's also a first for DRAM, although CPU manufacturers like Intel have been using this process technology since 2007 when the company
used it for its Penryn Core 2 processors.
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