Amkor, a leading OSAT (outsourced semiconductor assembly and test) service provider, on Tuesday
announced plans to build an advanced chip packaging facility in the U.S. The company plans to invest around $2 billion in the new facility, which will be located in Arizona and will be used to package chips produced by TSMC at a fab nearby.
Apple is set to become the largest customer of the facility.
The upcoming advanced packaging facility near Peoria, Arizona, will feature a massive 55-acre state-of-the-art manufacturing campus with over 500,000 square feet (46,451 square meters) of cleanroom space when fully built and equipped. To put the number into context, the cleanroom space of the Peoria plant will be over two times larger than the cleanroom space of
Amkor's advanced chip packaging facility in Vietnam. The initial phase of the Peoria factory, which will use Amkor's leading-edge technologies for advanced packaging and testing of chips for computing, automotive, and communications applications is expected to be operational within two to three years, so in 2025 or 2026.
"Expansion of a US semiconductor supply chain is underway, and as the largest US-headquartered advanced packaging company, we are excited to lead the charge in bolstering America’s advanced packaging capabilities," said Giel Rutten, Amkor’s president and chief executive officer said in a press release.
