Earlier today, Samsung announced that it has developed a new memory module standard that could show up on Intel's platforms as early as next year. In an industry-first, the South Korean giant has developed a Low Power Compression Attached Memory Module (LPCAMM). Samsung claims that this new memory can be more power efficient while offering better performance compared to the current offerings. Currently, manufacturers have the option of using two types of memory modules- Low-Power Double Data Rate (LPDDR) DRAM or Small outline Dual In-line Memory Module (So-DIMM). LPDDR is compact but is attached to the motherboard, making it ideal for smaller devices like mobiles and smartwatches. So-DIMM, on the other hand, is bigger but is removable, making it great for reparability.
Samsung is not the first company to go out of its way to develop a new memory design. Last year, Dell announced that it had developed
Compression Attached Memory Module (CAMM) which addressed a lot of So-DIMM's shortcomings. Samsung claims that LPCAMM infuses So-DIMM's reparability with LPDDR's compactness, making it a great alternative for all kinds of devices, including smartphones and laptops. Samsung notes that LPCAMM takes up to 60% less space while improving the performance and power efficiency by up to 50% and 70% respectively. This, combined with the fact that LPCAMM is detachable, makes it a great option for all types of hardware.
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