Intel is investing $7 billion to improve its semiconductor packaging

silversurfer

Level 85
Thread author
Verified
Honorary Member
Top Poster
Content Creator
Malware Hunter
Well-known
Aug 17, 2014
10,048
With the ongoing supply chain and semiconductor crisis, Intel is making a slew of strategic decisions to prevent something like this from happening again in the future and to get back on track. The company is not only making new investments in the US, but it is also sanctioning many international projects as well. The latest development from Team Blue is that it is planning to spend $7 billion to expand its packaging facilities in Penang, Malaysia.

Back in May this year, Intel had announced that it is going to spend $3.5 billion on its Rio Rancho packaging facility in Albuquerque, New Mexico. Packaging is an essential part of semiconductor manufacturing and design. It not only affects the cost of chip production but also affects the power, performance, and basic functionality of a chip on a micro-level.

Intel is expanding into a new packaging generation called copper hybrid bonding interconnect. This is used when chip dimensions get below 10 microns and helps deliver a 10x improvement in interconnect density.

Intel will be announcing the expansion officially on Wednesday at Kuala Lumpur airport with Intel CEO Pat Gelsinger, Malaysia’s trade minister, and the CEO of the Malaysian Development Authority.
 

About us

  • MalwareTips is a community-driven platform providing the latest information and resources on malware and cyber threats. Our team of experienced professionals and passionate volunteers work to keep the internet safe and secure. We provide accurate, up-to-date information and strive to build a strong and supportive community dedicated to cybersecurity.

User Menu

Follow us

Follow us on Facebook or Twitter to know first about the latest cybersecurity incidents and malware threats.

Top