- Jan 8, 2011
- 22,361
In a nutshell, Kioxia proposes to skip dicing, assembly, chip packaging, and SSD drive assembly, but use a whole wafer with 3D NAND instead.
The wafer is to be probed using Kioxia’s ‘super multi-probing technology’ to discover as well as disable faulty 3D NAND dies and then attached to a pad with I/O and power connectors. The whole thing should be operated in parallel to extract maximum sequential and random IOPS performance.
Read more at Source.