SEOUL, July 25 (Reuters) - Samsung Electronics (005930.KS), opens new tab said on Saturday it struck a pact with U.S. chip designer Broadcom (AVGO.O), opens new tab to widen cooperation across memory chips, contract chip making and advanced packaging envisaged to exceed $200 billion until 2030.
The tie-up comes as global technology companies increasingly develop their own custom AI accelerators, rather than relying solely on general-purpose graphics processors, driving demand for specialised chip design and manufacturing partnerships.